Working with WIN

WIN Enterprises offers a wide range of commercial off the shelf (COTS) products, but its true specialty is the design and manufacture of custom solutions -- usually high-end motherboards with extended product lives. Our COTS products can be modified to meet your more exact requirements; and WIN can modify your embedded product at smaller volumes than the larger Original Design Manufacturers (ODMs).

 

WIN provides several value-added advantages over its competitors, providing exceptional service across the design and manufacturing phases. Customers of all size receive Tier One support. The integration of all the design and manufacturing phase reduces yours risks and speeds your products to market

WIN products are designed for long life using true embedded components. Our ability to manage a product's life cycle means we work to extend its lifetime and then provide a seamless transition to your next-generation product. In addition to design and manufacturing, WIN offers value-added services for software installation, testing, branding, package design, and drop-shipping to make your life easier.

Virtually all WIN Enterprises' products are RoHS compliant. WIN can also secure other industry validations and certifications, such as UL, TUV, CSA, etc.

WIN Enterprises will modify its existing designs based on your market needs

when you are ordering in typical OEM quantities. We will also design totally from scratch

to provide you even more product differentiation when required. Any NRE charges

will depend on the nature of the overall agreement.

 

Embedded Development Kits

A robust set of Development Kits based on the experience of hundreds of successful designs across a wide variety of applications will provide you with a fast time-to-market with a unique solution that differentiates your solution in your market.

WIN maintains a library of core design modules in the following application areas:

  • Networking & Network Security
  • Internet Appliances
  • Mobile/intense Computing
  • Telecommunications
  • Industrial PC / Industrial Automation
  • Transaction Terminals / POS Systems
  • Gaming/Entertainment/Digital Home
  • Medical Devices/Scientific Instrumentation
  • Transportation/Automotive
  • Military/Aerospace/ Law Enforcement
  • #
  • Custom Embedded Solutions
  •  #
  • - Fully Custom Boards & Appliances
  • - Our Experience Enables Fast Time-to-Market
  • - Complete Design & Manufacturing Services
  • - Product Life-cycle & Component Management
  • - Smooth Roll-out Provided for Subsequent Product Generations
  • #
  • System Definition Phase
  • #

System definition is the most critical phase in manufacturing projects. The functionality and performance of a product are defined within this stage. This becomes the basis for determining your product’s specifications. In this phase WIN will help:

  1. Define the product’s objectives and functionality of each product part
  2. Explore alternatives for components, considering availability, reliability, and longevity
  3. Propose a custom solution if an off-the-shelf solution does not exist

Electronic Design / Product Development

WIN's engineering team maximizes performance while minimizing development time and overhead costs. We draw upon years of knowledge and experience to produce your customized motherboard or appliances.

Every day WIN's engineers are setting new standards for performance, reliability, and value.

During the design/development phase WIN will:

  1. Develop the product design
  2. Explore the various options available
  3. Develop a technology roadmap that will be used in the final phase of development

Embedded X86 Design Process

  1. Project Plan
  2. Statement of Work
  3. Develop Final Specification
  4. Review Engineering Specification
  5. Release Final Specification
  6. Develop Final Block Diagram
  7. Customer Review
  8. Accept Final Block Diagram
  9. Develop Schematics
  10. Provide Complete Mechanical Specifications
  11. Pre-Route
    A) Signal Integrity Analysis
    B) Review Specifications
    C) Support Stack-Up Selection
    D) Develop Routing Rules
    E) Develop Pre-Routing Simulations
    F) Review and Cleanse Models
  12. Develop Bill of Materials (BOM)
  13. Design Review
  14. Accept Schematics
  15. Component Placement and Mechanicals
  16. Baseline Thermal Model
    A) Develop Baseline Thermal Profile
    B) Review Worst Case Voltages and Power
    C) Review Air Flow Strategy
  17. Design Review
  18. Accept Placement
  19. Final Thermal Simulation
  20. Procure Long-Lead Items for Prototypes
  21. Routing
  22. Support Routing Effort
  23. Cross-Reference Design Guides
  24. Electrical Simulation (post-route)
    A) Trace Length / Impedance Analysis
    B) Signal Integrity
    C) Cross Talk Screening
    D) Split Plane Discontinuity Analysis
  25. Deliver Design Files
  26. Final Design Review
  27. Accept Final Design
  28. PCB Manufacture
  29. Develop Mechanical Samples
  30. Assemble Prototypes
  31. Board Testing
  32. Engineering Validation
  33. Customer-Specific Testing
    A) Application Testing
    B) Certifications
    C) HALT/HASS
    D) MTBF/ORT
  34. Deliver Working Prototypes to Customer
  35. Release

Design Validation Process

  1. WIN adheres stringently to the design guides of its customers, notably Intel and AMD
  2. Customer Design Guides
  3. Post-Route Simulation
    A) Trace Length / Impedance Analysis
    B) Signal Integrity
    C) Crosstalk Screening
    D) Split Plane Discontinuity Analysis

Engineering Validation Process

  1. Functional Testing & Specification Verification
  2. Voltage Margin Testing & Analysis
  3. Temperature Margin Testing & Analysis
    A) Develop Baseline Thermal Profile
    B) Review Worst Case Voltages and Power
    C) Review Air Flow Strategy
    D) Perform Final Simulation
    E) Thermal Analysis Tool: FloTherm

Signal Integrity Analysis: Pre-Route

  1. Review Specifications
  2. Support Stack-Up Selection
  3. Develop Routing Rules
  4. Develop Pre-Route Simulations
  5. Review and Cleanse Models
  6. SI Tools:
    A) SPECTRAQuest
    B) Hyperlynx
    C) HSPICE

Design Validation Process

  1. Intel Design Guides
  2. Customer Design Guides
  3. Post-Route Simulation
    A) Trace Length / Impedance Analysis
    B) Signal Integrity
    C) Crosstalk Screening
    D) Split Plane Discontinuity Analysis

Engineering Validation Process

  1. Functional Testing & Specification Verification
  2. Voltage Margin Testing & Analysis
  3. Temperature Margin Testing & Analysis
    A) Develop Baseline Thermal Profile
    B) Review Worst Case Voltages and Power
    C) Review Air Flow Strategy
    D) Perform Final Simulation
    E) Thermal Analysis Tool: FloTherm
     

Compliance & Certifications

 

  1. Functional Testing & Specification Verification
  2. Voltage Margin Testing & Analysis
  3. Temperature Margin Testing & Analysis
    A) Develop Baseline Thermal Profile
    B) Review Worst Case Voltages and Power
    C) Review Air Flow Strategy
    D) Perform Final Simulation
    E) Thermal Analysis Tool: FloTherm

Routing

  1. 1. Procure Long-Lead Items for Prototypes
  2. 2. Routing
  3. 3. Support Routing Effort
  4. 4. Cross-Reference Design Guides
  5. 5. Electrical Simulation (post-route)
    1. A) Trace Length / Impedance Analysis
    2. B) Signal Integrity
    3. C) Cross Talk Screening
    4. D) Split Plane Discontinuity Analysis

Release to Customer

  1. 1. Deliver Design Files
  2. 2. Final Design Review
  3. 3. Accept Final Design
  4. 4. PCB Manufacture
  5. 5. Develop Mechanical Samples
  6. 6. Assemble Prototypes
  7. 7. Board Testing
  8. 8. Engineering Validation
  9. 9. Customer-Specific Testing
    1. A) Application Testing
    2. B) Certifications
    3. C) HALT/HASS
    4. D) MTBF/ORT
  10. 10. Deliver Working Prototypes to Customer
  11. 11. Release

Conclusion

WIN Enterprises works closely with its OEM customers to deliver embedded solutions that meet or exceed their market requirements. These designs can be COTS, modified COTS or custom platforms. NRE charges are negotiated with the customer based on the extent of the NRE effort and ultimate production volume. For instance, the cost of minor modifications may be absorbed by WIN Enterprises (production volumes allowing). Ownership of a custom design may be shared by WIN and OEM customer based on the proportion of NRE funding that is absorbed by each - or can be owned outright by the OEM, if desired. The use of development modules speeds the NRE process, ensures reliability and helps keep costs low. Designs are maximized for long product life-cycle to provide the best possible return on investment (ROI) for the OEM customer.

WIN ENTERPRISE SERVICES: HARDWARE DESIGN, MANUFACTURING & FULFILLMENT

sales@win-ent.com

 

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